led data sheet - SEP121404A SEP121404A external shape type 3.52.8 flat view led color red application automotive, consumer electronics, office automation, indicator feature msl-3, rohs compliant, compatible with heat-resistance of lead-free solder. absolute maximum ratings description symbol unit power dissipation pd mw forward current if ma forward current reduction Sif ma/ pulse forward current ifp ma reverse voltage vr v operating temperature topr storage temperature tstg junction temperature tjmax photoelectric characteristic(ta=25) description symbol min typ max unit forward voltage vf 2.1 2.6 v reverse current ir 10 ua luminous intensity iv 490 600 733 mcd dominant wavelength 624 nm thermal resistance j-a 150 /w luminous intensity rank (ta=25) (tolerances:10%) d 452 600 e 600 748 dominant wavelength rank (ta=25) (tolerances:1nm) r 622 625 r1 625 628 y 588 591 sanken electric company, ltd. rank luminous intensity range(mcd) rank 91 f=1khz twQ100 s above80 35 115 vr=3v i f = 20ma conditions i f = 20ma dominant wavelength range(nm) ratings 100 remark i f = 20ma 40100 3 -1.0 40100 page 1 / 9
led data sheet - SEP121404A characteristic data sanken electric company, ltd. directional angle d istribution of luminous intensity angle [degree] if - iv (8 0 ,35m (100 , 15ma) page 2 / 9
led data sheet - SEP121404A outline sanken electric company, ltd. page 3 / 9 m a t e r i a l o f r e s i n m a t e r i a l & f i n i s h o f l e a d s 1 . 9 ( 0 . 7 8 ) ( 0 . 7 8 ) 3 . 4 7 c 0 . 4 1 . 1 8 1 . 0 8 0 . 5 8 1 . 1 8 1 . 5 2 . 2 0 . 2 2 . 7 2 . 5 3 . 5 2 . 8 r e c o m m e n d a b l e s o l d e r i n g p a t t e r n ( f o r r e f l o w s o l d e r i b g ) 4 . 5 1 . 5 2 . 6 c a t h o d e m a r k a n o d e c a t h o d e t o l e r a n c e 0 . 2 c o p p e r - i r o n a l l o y s i l i c o n e m a t e r i a l a g p l a t i n g m a t e r i a l f i n i s h
led data sheet - SEP121404A soldering conditions following soldering conditions are recommended. ?reflow conditionsat the surface of led resin pre-heat 150 180 60 120 sec soldering temperature soldering time more than 220 is less than 40 sec. peak temperature is should be is less than 260. ?manual soldering temperature of soldering iron tip should be 35010 for 3 seconds, which shall apply to only one soldered point and once for the each soldered point. sanken electric company, ltd. page 4 / 9 reflow soldering profile 20 60 100 140 180 220 260 300 0 50 100 150 200 250 300 soldering time temperature of surface led[] pre-heat 60 120 sec max 40 sec peak max 260
led data sheet - SEP121404A attention after opened the led is in smd package. when the led is mounted by means of soldering and the resin is unusually damp, soldering may cause interfacial defoliation. this occurs when a drastic temperature change causes moisture in the resin to evaporate and to swell. therefore, attention to the below must be paid. ?atmosphere when using the leds after package is opened after opened and mounted, soldering should be carried out quickly. following atmosphere is recommended when using (and mounting) the leds. temperature : 530 humidity : less than 70% ?baking in case 168 hours have passed after package is opened, leds must be dried as follows. 605 for more than 24 hours (taping reel) ?storage after package is opened following storage conditions are recommended after package is opened. in case indicator color (blue) of desiccant (ex. silica gel) has disappeared, leds must be dried under the same conditions as above. other ?after soldering any mechanical force or excessive vibration should not be applied to leds during cooling process until the leds cool down to normal temperature. ?quick cooling must be avoided. ?the leds should not be mounted on warped direction of pcb. ?this product series emits high light power. do not look directly into the light emitting area. direct exposure to the light over an extended time period may harm eyes. ?extra attention should be paid to the sealing resin of the product, which is silicone resin. ?the emitting area of the leds contains fine gold wires. touching this area witout care may add excess stress on the internal gold wires and may result in ?the silver plating of the leadframe may discolor if the product comes into contact with material containing sulfides or if it is exposed to an atmosphere containing sulfide gas. sanken electric company, ltd. page 5 / 9
led data sheet - SEP121404A reliability test sanken electric company, ltd. page 6 / 9 test items eiaj ed-4701 test conditions life steady state operating life - ta=rt ifmax tests t=1000h high temperature storage 201 ta=tstgmax t=1000h low temperature storage 202 ta=tstgmin environ t=1000h -mental moisture resistance 103 ta=605 rh=905 tests t=1000h temperature cycle 105 tstgmin(30min) tstgmax(30min) 100cycles soldering heat 301 t=2605 t=10s 1time solderaibirity 402 t=2455 t=51s 1time using flux for pb free solder drop - h=1m drop on maple board 10times mesurement item and criterion judge failure no measurement item mark criterion judge failure 1 forward voltage vf ok Q v.f.s.20 2 luminous intensity iv ok R i.v.s.0.5 *solderability the lead shall be covered by solder at least 95%. mesurement conditions is based on specifications. tstgmax and tstgmin is absolute maximum ratings. ifmax and ifpmax is absolute maximum ratings. u.s.l. is upper limit of standard. v.f.s. is initial data of vf. i.v.s. is initial data of luminous intensity.
led data sheet - SEP121404A packing packing materialaluminum laminated moisture-proof packing quantity 2000 pcs (minimum order quantity) label see below. ) partnumber sep lotno last digit of year month (januaryseptemberarabic numeral october onovemberndecemberd) day quantity 2000pcs rank luminous intensity rank chromaticity rank sanken electric company, ltd. page 7 / 9 ? ? ? y ? 2 3 0 5 2 7 0 5 s a n k e n e l e c t r i c c o . , l t d m a d e i n j a p a n l o t n o . * * * * r a n k * - * p / n s e p * * * * * * n o t c h b o t h s i d e s z i p p e r l a b e l u n i t m m q t y 2 , 0 0 0 p c s
led data sheet - SEP121404A taping reel dimensions unit:mm sanken electric company, ltd. page 8 / 9 t a p i n g r e e l d i m e n s i o n s l a b e l l a b e l 0 . 5 2 . 2 0 . 5 0 . 1 5 1 2 . 0 1 . 0 1 7 8 6 0 9 . 0 0 . 3 2 2 1 3 0 . 2 t o l e r a n c e 0 . 2 t h e q u a n t i t y p e r r e e l s h a l l b e 2 0 0 0 p c s . c o m u l a t i v e t o l e r a n c e p e r 1 0 p i t c h e s s h a l l b e 0 . 2 m m . a d h e s i o n s t r e n g t h t o b e 0 . 1 - 0 . 7 n w h e n t h e c o v e r t a p e i s t u r n o f f f r o m t h e c a r r i e r t a p e a t 1 0 a n g l e t o b e c a r r i e r t a p e . p / n , m a n u f a c t u r i n g d a t e c o d e n u m b e r a n d q u a n t i t y s h a l l b e i n d i c a t e d o n a d a m p p r o o f p a c k a g e . q u a n t i t y c o m u l a t i v e t o l e r a n c e a d h e s i o n s t r e n g t h o f c o v e r t a p e p a c k a g i n g
led data sheet - SEP121404A tips ?the contents written in this data sheet may be changed without a preliminary announcement by improvement etc. when you use it, please check that information is the newest and conclude specifications. ?application and operation examples described in this publication are quoted for the sole purpose of reference for the use of the products herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of sanken or any third party which may result from its use. ?when using the products specified herein by either combining other products or materials therewith or physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ?although sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. ?sanken products listed herein are intended for use as components of general purpose electronic equipment or apparatus (such as home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). prior to use of the sanken products, please put your signature, or affix your name and seal, on the specification documents of the sanken products and return them to sanken. when considering use of the sanken products for any applications that require higher reliability (such as transportation equipment and its control systems, traffic signal control systems or equipment, disaster/crime alarm systems, various safety devices, etc.), you must contact a sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal, on the specification documents of the sanken products and return them to sanken, prior to the use of the sanken products. the sanken products are not intended for use in any applications that require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result in death or serious injury to people, i.e., medical devices in class iii or a higher class as defined by relevant laws of japan (collectively, the specific applications). sanken assumes no liability or responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, resulting from the use of the sanken products in the specific applications or in manner not in compliance with the instructions set forth herein. ?anti radioactive ray design is not considered for the products listed herein. ?sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sankens distribution network. sanken electric company, ltd. page 9 / 9
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